Job Overview
Compensation
Salary
Range $180,500.00 - $270,700.00
Benefits
Health Insurance
Dental Insurance
Paid Time Off
Retirement Plan
Disability insurance
Employee stock purchase plan
bonus program
Job Description
Qualcomm Technologies, Inc. is a global leader in the development and innovation of wireless technologies and semiconductor solutions. As a pioneering company in the tech industry, Qualcomm has revolutionized connectivity and computing, delivering state-of-the-art products and platforms that power the world’s most advanced mobile devices, IoT solutions, and data centers. Renowned for its commitment to research and development, Qualcomm fosters an innovative environment where technology experts collaborate to solve complex challenges and create cutting-edge technologies that shape the future of computing and communications. The company prides itself on a dynamic workplace culture that values diversity, continuous learning, and the pursuit of excellence in technology and engineering.
Within this framework, Qualcomm Technologies' Data Center team is dedicated to designing and developing high-performance, energy-efficient server solutions specifically tailored for data center applications. This team is at the forefront of advancing server platform technology, leveraging Qualcomm’s Snapdragon System on Chip (SoC) technology to create comprehensive, scalable solutions that integrate hardware, software, reference designs, SDKs, and user guides. The Data Center team addresses critical industry needs by delivering servers that optimize performance, power efficiency, and thermal management, enabling customers to meet increasing computing demands sustainably.
The Thermal Engineer role plays a pivotal part in this innovative endeavor. As an experienced individual contributor, the Thermal Engineer will work closely with the platform team to develop next-generation, high-performance server systems. This position is deeply hands-on, emphasizing thermal testing, characterization, and validation of server hardware components, including heat sinks, cold plates, cooling solutions, and airflow dynamics. Collaborating cross-functionally with packaging, electrical, mechanical engineering, and component suppliers, the Thermal Engineer will use rigorous lab work to validate and enhance thermal models and contribute to the design and implementation of thermal solutions that are critical to system reliability and performance.
The successful candidate will engage with real-world thermal challenges common in data center environments, such as rack-level cooling, high-density compute zones, and airflow management. They will utilize their expert knowledge of thermal interface materials (TIMs), heat transfer principles, and thermal simulation tools to drive improvements in thermal efficiency and system robustness. Beyond technical execution, the Thermal Engineer will document findings, prepare reports, and communicate results to diverse stakeholders including engineering teams, senior management, suppliers, and customers.
This role requires an expert blend of practical lab experience and theoretical understanding, ideally supported by a strong educational foundation in mechanical engineering, materials science, or related fields. The company offers a competitive salary range of $180,500 to $270,700, complemented by a discretionary bonus program, RSU grants, and a highly competitive benefits package designed to support employees both professionally and personally. Qualcomm also emphasizes an accessible and inclusive hiring process, ensuring reasonable accommodations for individuals with disabilities.
Joining Qualcomm as a Thermal Engineer means becoming part of a world-class engineering team dedicated to transforming the data center industry through cutting-edge thermal management, sustainable design, and technological excellence. It is a unique opportunity to impact the future of server technology and contribute to the global advancement of efficient, high-performance computing platforms.
Within this framework, Qualcomm Technologies' Data Center team is dedicated to designing and developing high-performance, energy-efficient server solutions specifically tailored for data center applications. This team is at the forefront of advancing server platform technology, leveraging Qualcomm’s Snapdragon System on Chip (SoC) technology to create comprehensive, scalable solutions that integrate hardware, software, reference designs, SDKs, and user guides. The Data Center team addresses critical industry needs by delivering servers that optimize performance, power efficiency, and thermal management, enabling customers to meet increasing computing demands sustainably.
The Thermal Engineer role plays a pivotal part in this innovative endeavor. As an experienced individual contributor, the Thermal Engineer will work closely with the platform team to develop next-generation, high-performance server systems. This position is deeply hands-on, emphasizing thermal testing, characterization, and validation of server hardware components, including heat sinks, cold plates, cooling solutions, and airflow dynamics. Collaborating cross-functionally with packaging, electrical, mechanical engineering, and component suppliers, the Thermal Engineer will use rigorous lab work to validate and enhance thermal models and contribute to the design and implementation of thermal solutions that are critical to system reliability and performance.
The successful candidate will engage with real-world thermal challenges common in data center environments, such as rack-level cooling, high-density compute zones, and airflow management. They will utilize their expert knowledge of thermal interface materials (TIMs), heat transfer principles, and thermal simulation tools to drive improvements in thermal efficiency and system robustness. Beyond technical execution, the Thermal Engineer will document findings, prepare reports, and communicate results to diverse stakeholders including engineering teams, senior management, suppliers, and customers.
This role requires an expert blend of practical lab experience and theoretical understanding, ideally supported by a strong educational foundation in mechanical engineering, materials science, or related fields. The company offers a competitive salary range of $180,500 to $270,700, complemented by a discretionary bonus program, RSU grants, and a highly competitive benefits package designed to support employees both professionally and personally. Qualcomm also emphasizes an accessible and inclusive hiring process, ensuring reasonable accommodations for individuals with disabilities.
Joining Qualcomm as a Thermal Engineer means becoming part of a world-class engineering team dedicated to transforming the data center industry through cutting-edge thermal management, sustainable design, and technological excellence. It is a unique opportunity to impact the future of server technology and contribute to the global advancement of efficient, high-performance computing platforms.
Job Requirements
- Bachelor's degree in Mechanical Engineering, Engineering Mechanics, Material Science, or related field
- Five plus years of hands-on experience in thermal engineering within the high-tech industry
- Strong background in heat transfer fundamentals including conduction, convection, and radiation
- Hands-on experience with thermal testing equipment and methodologies
- Experience with thermal interface materials (TIMs) selection and application
- Familiarity with thermal challenges in package design and silicon architecture
- Experience with thermal simulation tools to complement lab work
- Ability to work independently and collaboratively in cross-functional teams
Job Qualifications
- Bachelor's or Master’s degree in Mechanical Engineering, Engineering Mechanics, Material Science, or related field
- Five plus years of hands-on experience in thermal engineering within the high-tech industry practical lab-based experience is critical
- Strong background in heat transfer fundamentals including conduction, convection, and radiation
- Proven hands-on experience with thermal testing equipment and methodologies including heat sink and cold plate characterization, air cooling and liquid cooling systems, wind tunnel testing, temperature measurements such as thermocouples and IR thermography, and flow metrology techniques
- Hands-on experience with thermal interface materials (TIMs) selection, application, and characterization
- Familiarity with thermal challenges associated with package design and silicon architecture and understanding of why capable thermal solutions are critical to product performance and reliability
- Some experience with thermal simulation tools such as Celsius EC, Flotherm, Icepak to support and complement experimental work
- Proven ability to work independently and collaboratively within a cross-functional team environment
- Experience addressing data center thermal challenges including high-density compute and rack-level thermal management
- Experience with Open Compute Project (OCP) product designs and standards
- Advanced proficiency in CFD tools such as Celsius EC, Flotherm, Icepak for more complex simulations
- Experience with scripting or programming languages such as Python, MATLAB for data analysis and automation
- Familiarity with industry standards and best practices for thermal management in server and data center environments
- Strong communication and presentation skills with the ability to clearly convey complex technical concepts to diverse audiences
Job Duties
- Lead and execute hands-on thermal testing and characterization of server hardware including heat sinks, cold plates, air cooling and liquid cooling solutions, wind tunnel evaluations, temperature measurements, and flow metrology
- Validate and improve thermal models and solutions through rigorous lab testing enhancing accuracy and real-world robustness
- Support thermal simulations at the die, package, and system level to analyze and optimize thermals complementing experimental findings
- Collaborate with internal teams including packaging, silicon architecture, mechanical, and system engineering to provide technical guidance and ensure alignment across requirements
- Apply hands-on knowledge of thermal interface materials (TIMs) to evaluate, select, and qualify materials for high-performance electronics
- Contribute to solving data center-specific thermal challenges including rack-level cooling, high-density compute environments, and airflow management
- Develop and maintain documentation, guidelines, and tools to support design processes and project success
- Prepare and present technical documentation and reports to stakeholders including engineering teams, senior management, customers, and suppliers
Job Criteria
Experience
Mid Level (3-7 years)
Job Location
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